Year: 2024
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Graphene Wiring in CMOS Arrives at Destination 2D
Startup Destination 2D is developing intercalation-doped multilayer graphene (MLG) to replace copper in CMOS chips. To make MLG compatible with CMOS fabrication, the company developed equipment to grow it at 300°C.
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Raspberry Pi Compute Module 5 Targets Industrial Systems
The Raspberry Pi shows what’s possible when a software community backs a conveniently sized, low-cost board with the right mix of peripherals and interfaces. From $45 boards to $45,000 GPUs, software and a developer community are essential to a processor’s success.
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Microsoft Unveils Custom HSM, DPU, and HBM-Powered Epyc Chips
Microsoft has announced a series of custom chips, highlighting the trend of hyperscalers developing their own hardware to gain a competitive edge. The new chips include a hardware security module (HSM), data processing unit (DPU), and an HBM-enabled AMD Epyc processor.
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3Q24 Processor Market: Prosperity is Here; It’s Just Not Evenly Distributed
On the back of rising Epyc sales and a strengthening MI300 outlook, AMD surpassed Intel in the data center. The PC market did well in Q3, but the embedded market didn’t meet expectations.
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Nvidia Recommits to HPC with H200 NVL and GB200 NVL4
Nvidia has announced two new hardware offerings for high-performance computing: the H200 NVL PCIe card and the GB200 NVL4 superchip leveraging NVLink. Nvidia’s continued focus on HPC underscores its commitment to serving the needs of researchers and enterprise developers.
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Andes Refines RISC-V Cores
Last month Andes Technology refreshed its high-end RISC-V CPU line. The new AX66 and AX46 raise integer performance by 15% over the earlier AX65 and AX45.