• Hot Chips 2026: Next-Gen AI Accelerators, Memory Innovations, and Arm Surprises

    Hot Chips sign at Stanford Memorial Auditorium

    At Hot Chips 2026, companies unveiled new processors and discussed related topics, such as memory and networking. Large companies dominated the agenda, and several had multiple speaking slots. Below are observations from the conference, covering the majority of the program. Quick links: How Are Memory Vendors Tackling HBM Thermal and Density Challenges? High-bandwidth memory (HBM)… continue reading

  • BWR 17: Hot Chips 2026 Discussion

    Video cap of Joe and Bob talking with a jalapeno in the background

    Join Byrne-Wheeler Report hosts Joe and Bob as they discuss key disclosures from Hot Chips 2026, including Intel’s Diamond Rapids Xeon, AMD’s Helios MI450 platform, NVIDIA’s LPX/LPU architecture, Cerebras’s CS-4 wafer-scale engine, and OpenAI’s Jalapeño ASIC. If you work in AI hardware, semiconductors, GPUs, CPUs, interconnects, or data center architecture, this episode delivers insight unavailable… continue reading

  • Taalas Technology to Boost AMD AI Performance and Efficiency

    Han Solo frozen in Carbonite

    AMD has acquired Taalas, an AI-acceleration startup that hardwires models to achieve eight times the token rate of its nearest competitor while requiring a fraction of the power. Located in Toronto and founded by Tenstorrent cofounder Ljubisa Bajic, Taalas has demonstrated a chip implementing the Llama 3.1 8B model. AMD states that the company will… continue reading

  • Ain’t Too Proud: The AMD MI455X Story

    AMD MI455X chip with Cubist filter applied

    AMD has aligned its data-center GPU architecture with that of market leader Nvidia. However, AMD highlights the token-throughput and efficiency gains of the new MI455X over the previous-generation MI355X instead of touting how customers will find it easier to port their AI models to the GPU. Implementing the CDNA 5 architecture, the MI455X is the… continue reading

  • BWR 16: AMD AI Day, Nvidia Vera, Astera Taurus, Hot Chips Preview

    Thumbnail of BWR-16 teasing discussion of AMD's AI day and Nvidia Vera

    In Episode 16 of the Byrne-Wheeler Report, Joe and Bob discuss the latest developments in AI hardware, including disclosures at AMD’s Advancing AI day, NVIDIA Vera, and upcoming conferences Hot Chips and OCP APAC. They analyze new processor architectures, interconnect standards, and market implications for AI and data center computing. Click above to play the… continue reading

  • AMD Scales Epyc 9006 “Venice” to 256 Cores and 1 GB of L3 Cache

    AMD Epyc 9006 package and die

    AMD has revealed the first models of its sixth-generation Epyc product line, Venice. Based on the new Zen 6 and Zen 6c cores, the now-shipping processors offer two packaging options. Maximum core count increases from 192 in the previous Turin generation to 256. As before, the highest-frequency chips boost to 5 GHz. Across the board,… continue reading

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