Year: 2024
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Chips Act Backs Chiplets
The Chips Act offers funds for companies involved in packaging and chiplets. Even if you don’t consider your organization to have packaging expertise, you may find an opportunity for it to contribute—and get a grant. However, you must act fast. Ten-page concept papers are due December 20. I’m available to help you apply.
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Arm Yanks Qualcomm’s Architecture License as Dispute Festers
Arm has terminated Qualcomm’s architecture license, escalating their ongoing dispute emerging from Qualcomm’s Nuvia takeover. The move affects both companies, as well as the broader semiconductor, smartphone, and PC industries.
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Semidynamics Integrates RISC-V Matrix Math
The Semidynamics AI processing element combines a RISC-V CPU with vector and tensor units, integrating—versus—attaching matrix acceleration. The company’s memory-access technology and customizable cores help it stand out in the crowded RISC-V market.
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Arteris Expands NoC Offerings for AI Accelerators
Arteris has introduced mesh-topology support for its FlexNoC and Ncore NoC IP, catering to the growing demand from AI accelerators and many-core processors. The company’s parameterizable NoC solutions offer flexibility, performance, power efficiency, and—most importantly—scalability.
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AMD Epyc 9005, MI325X, and Salina Debut at AI Gala
AMD paraded new data-center and PC processors at an AI-themed pep rally this week that featured partners and customers cheering the company’s advancements. Most of the products had been discussed previously but in only vague terms.
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Intel’s Arrow Lake-S (Core Ultra 200S) Reduces Power
Intel’s Arrow Lake-S desktop processors improve performance and power efficiency compared with their predecessors, maintaining Intel’s solid competitive market position. The weak NPU is a branding problem, but the bigger AI problem is the technology’s weak consumer benefits.